منابع مشابه
3-D RF Coil Design Considerations for MRI
High-frequency coils are widely used in medical applications, such as Magnetic Resonance Imaging (MRI) systems. A typical medical MRI includes a local radio frequency transmit/receive coil. This coil is designed for maximum energy transfer or wave transfer through magnetic resonance. Mutual inductance is a dynamic parameter that determines the energy quantity to be transferred wirelessly by ele...
متن کامل3-D ICs: Performance Analysis, and Technology
Interconnect delays are increasingly dominating IC performance due to increases in chip size and reduction in the minimum feature size [1]. In spite of new materials like Cu and a low-k dielectric interconnect delay is expected to be substantial below 130 nm technology node, thereby severely limiting chip performance [2]. Therefore, the need exists for alternative technologies to overcome this ...
متن کاملInter-Plane Communication Methods for 3-D ICs
Three-dimensional (3-D) integration is an emerging candidate for implementing high performance multifunctional systems-on-chip. Employing an efficient medium for data communication among different planes is a key factor in achieving a high performance 3-D system. Through Silicon Vias (TSVs) provide high bandwidth, high density inter-plane links while facilitating the flow of heat in 3-D circuit...
متن کاملThermal-Aware Physical Design Flow for 3-D ICs
3-D IC technologies have recently drawn great interest due to their potential performance improvement, power consumption reduction and heterogeneous components integration. One of the largest challenges in 3-D IC design is heat dissipation. In this paper we propose a thermal-aware physical design process for 3-D ICs, including floorplanning (3DFP-T), placement (T3Place) and routing (TMARS). Tem...
متن کامل3-D ICs as a Platform for IoT Devices
3-D ICs are a natural platform for IoT devices. IoT devices exhibit a small footprint, integrate disparate technologies, and require long term sustainability (extremely low power or self powered). The 3-D structure exhibits opportunities essential for IoT devices, including heterogeneity, small form factor, and reduced power dissipation, making 3-D integration a favorable candidate for IoT devi...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: The Journal of Korean Institute of Electromagnetic Engineering and Science
سال: 2013
ISSN: 1226-3133
DOI: 10.5515/kjkiees.2013.24.10.964